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工程名
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設備名
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写真
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CAPA
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工程能力
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技術力
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露光
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Existing Normal Pattern 1Line
Polarize Exposure 1Line
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55,000㎡/Mon
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UV Source : Collimate
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Line & Space : 50/50
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D.E.S
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2 D.E.S Line
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40,000㎡/Mon
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Nor. 50/60/ Min. 40/50
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Line & Space : 50/50, Pattern Tolerance : ± 10%
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仮接&積層
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16 Hot Press Line
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40,000㎡/Mon
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VACCUM : YES, TONNAGE : 350 Tons(MAX),
RAM DIA : 450Φ
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Max Layer : 12L, After Thickness : ± 5%
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CNCドリル
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4 Axis/6 CNC Line, 5 Axis/2 CNC Line, 6 Axis/3 CNC Line
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25,000㎡/Mon
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Spindle RPM : 2,000Rpm(MAX), Q.I.C Method : YES
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Min Hole Φ : 0.1mmΦ
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LASERドリル
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2 Line
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2,000 ㎡/Mon
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Source : UV Source
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Min Hole ¢: 0.05 mmΦ
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銅メッキ
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1 Copper Plating Line
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20,000 ㎡/Mon
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Double : 10~20, Multi : 15~25
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± 10
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PSR COAT
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Coater 4 Line, Dryer 3 Line Exposure 2 Line
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Coater :10,000㎡/Mon
Dryer : 10,000㎡/Mon
Exposure : 10,000㎡/Mon
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Thickness : 15~25
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± 5
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検査
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8 BBT Line
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20,000㎡/Mon
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BBT Resistance : 100 ~ 500/100V
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PRINT
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5 Silk Screen Line
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15,000㎡/Mon
Electric Plating 15,000㎡/Mon,
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Nor. 0.2mm
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± 0.1mm
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表面処理
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1 Electric Plating Line, 1 Chem Plating Line
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Chem Plating Line 15,000㎡/Mon
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Ni : 3~ 8,
Au : Min 0.03, Tin : Min 0.5
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PRESS
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60/80 ton Press 11 Line
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20,000㎡/Mon
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Nor. 0.1mm,
Min : 0.05mm
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S.M.T
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Mounter/Solder 10 Line
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20,000 ㎡/Mon
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Sn/Pb Free, BGA
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